Effect of Curing Temperature on Nano-Silver Paste Ink for Organic Thin-Film Transistors
- 저자
- Minseok Kim, Jae Bon Koo, Kang-Jun Baeg, Yong-Young Noh, Yong Suk Yang, Soon-Won Jung, Byeong-Kwon Ju, and In-Kyu You
- 저널명
- Journal of Nanoscience and Nanotechnology, 12, 4, 3272-3275 (2012)
- 년도
- 2012
- Link
- http://dx.doi.org/10.1166/jnn.2012.5639 140회 연결
[Abstract]
Silver (Ag) metal electrode having 20 μm channel length was printed by reverse offset printing (ROP) using nano-silver paste ink for the source/drain of organic thin-film transistors (OTFT). Specific resistance and surface roughness of printed Ag electrodes with increasing curing temperature were investigated, and surface morphology and grain growth mechanism were systematically verified using a scanning electron microscope (SEM) and atomic force microscope (AFM) in order to obtain an optimized ROP Ag electrode. The Ag electrode was applied to fabricate top-gate/bottom-contact poly(3-hexylthiophene) OTFT devices, which showed reproducible OTFT characteristics such as the field-effect mobility, threshold voltage, and an on/off-current ratio of ∼10−3 cm2/Vs, 0.36 V, and ∼102, respectively.
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